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Wafer Processing Equipment - List of Manufacturers, Suppliers, Companies and Products

Wafer Processing Equipment Product List

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Single-wafer processing device "Automatic Wafer Cleaning System"

Single-wafer processing device "Automatic Wafer Cleaning System"

Composed of a combination of a 3-axis multi-joint clean robot and a single-axis robot!

Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at low prices. The "Automatic Wafer Cleaning System" consists of a sheet-type automatic cleaning device, with wafer transport configured using a 3-axis multi-joint clean robot and a uniaxial robot for front and rear transport. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette - Also available in a type that can use FOUP in addition to cassettes For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment

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Single-wafer processing device "Automatic Etching Device"

Single-wafer processing device "Automatic Etching Device"

Install a 3-axis multi-joint clean robot at the center of the device for wafer transport!

Japan Create Co., Ltd. is a manufacturer primarily dealing with semiconductor manufacturing equipment, as well as other equipment such as LCD manufacturing devices. Since all products are manufactured in-house, we can offer them at a low cost. The "Automatic Wafer Cleaning Device" is a single-wafer automatic etching device. The wafer transport is equipped with a 3-axis multi-joint clean robot located at the center of the device, and the loader and unloader can be either FOUP or cassette type. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

  • Etching Equipment

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Single-wafer processing device "Automatic substrate developing device"

Single-wafer processing device "Automatic substrate developing device"

Install a 3-axis multi-joint clean robot at the center of the device for substrate transport!

The "Automatic Substrate Development Device" is a sheet-type automatic development device for substrates. The developer solution is maintained at a constant temperature by an electronic cooler and is sprayed onto the wafer for high-precision development processing. Additionally, the development method can be selected between spray type and paddle type. Substrate transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette types. 【Features】 ○ Suitable for wafers from 2 inches to 18 inches and 300mm square substrates ○ Uses a multi-joint robot from the loader ○ Automatically processes through each step to the unloader cassette For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment

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Single Wafer Processing Equipment "Automatic Wafer Resist Coating Device"

Single Wafer Processing Equipment "Automatic Wafer Resist Coating Device"

Wafer resist coating device that uses high-performance pumps for high-precision coating.

The "Automatic Wafer Resist Coating Device" is a sheet-type automatic resist coating device. The resist coating uses a high-performance pump according to viscosity, enabling high-precision application. Additionally, it can be used for applying adhesives and protective films, among other applications. The wafer transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette types. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

  • Resist Device

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Single Wafer Processing Equipment "Automatic Resist Coating and Developing System"

Single Wafer Processing Equipment "Automatic Resist Coating and Developing System"

Wafer resist coating device that uses high-performance pumps for high-precision coating.

The "Automatic Resist Coating and Developing System" is a sheet-type automatic resist coating and developing device. It is equipped with a resist coating chamber and a developing chamber. The resist coating uses a high-performance pump according to viscosity, allowing for high-precision coating. Additionally, the developing solution is constantly maintained at a constant temperature through an electronic cooler and circulated, enabling high-precision developing processing. The transportation of wafers is handled by a 3-axis multi-joint clean robot installed at the center of the device, which is also equipped with a loader and unloader. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.

  • Resist Device

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